300 mm Ultra-thin Wafer Handling Capabilities
Fabrinet has the capability to support the needs of both handling and processing 200-300 mm ultra-thin silicon wafers. Our in-line system is capable of thinning wafers down to 0.025 mm thick.
Our services include the entire process; from un-bumped wafers to the shipment of dies to the end-customer in various packages (including tape and reel).