Circuit Board Assembly

Printed Circuit Board Assembly

Fabrinet supports a complete range of PCB Assembly services, starting with component mounting through extensive inspection and testing processes. Fabrinet’s stringent quality practices within an environment of continuous improvement and cost reduction ensure the consistency and quality of the finished product.

We accommodate high-mix/low-volume and low-mix/high-volume solutions by using state-of-the-art equipment; flexible and scalable manufacturing infrastructure; and various multiple-line configurations.

PCB assembly processes include:

  • SMT manufacturing
  • Advanced packaging
  • Inspection
  • Test
  • Complex Systems

SMT Manufacturing

Fabrinet offers extremely flexible SMT manufacturing services for component mounting. This includes uBGA, CSP, COB, and flip chip processes. State-of-the-art equipment and multiple SMT lines achieve volume through speeds ranging from medium to very high for high-precision production.

  • Component Mounting
  • Passive components as small as 01005 >> 03015
  • Various IC Packages include BGA, mBGA, QFP, flip chip, and COB
  • Thru-hole components
  • Soldering Process
  • IR reflow and wave soldering
  • RoHS compliant process
  • Hot-bar soldering to attach flex circuit to PCB
  • Visual Inspection
  • AOI
  • X-ray (2-D and 3-D)
  • Ionic contamination test
  • PCB Testing
  • ICT (HP 3070)
  • Flying probe
  • DFM support production

Advanced Packaging

Fabrinet offers advanced engineering technology and state-of-the-art equipment for comprehensive, advanced packaging services including:

  • SMD evaluation
  • Flip chip assembly
  • Flip chip inspection


  • Flip chip placement (uBGA, CSP, flip chip to +/- 50 um at six sigma)
  • Automatic optical inspection
  • Adhesive dispensing and conformal coating (in-house)
  • C-Sam
  • Wave soldering
  • Cleaning (inline hydro clean machine)
  • Automatic router
  • Hot bar soldering


Fabrinet’s extensive, fully-equipped, in-house inspection labs ensure the highest quality from incoming raw material. We achieve this by checking on incoming material and quality throughout processing.

  • Incoming Inspection
  • PCB detail
  • Micro-cross section capability
  • Qualification Build/ process verification
  • BGA solder joint
  • Solder paste AOI
  • Solder joints cross section
  • C-SAM
  • Automatic optical inspection incorporating
  • 2-D/ 3-D X-ray


Following assembly, Fabrinet runs products through a stringent series of custom-designed (or customer-specified) tests to ensure proper operation and adherence to our customer’s specifications. Testing equipment and services include:

  • Agilent HP 3070 series II and III
    • Test jet
    • Boundary scan
  • Flying probe ICT TAKAYA APT-9411CE
  • Prototype testing
  • Functional testing
  • Test bench development
  • Test bench